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Integration-the Vlsi Journal

Integration-the Vlsi Journal杂志,由Elsevier出版,于1983年创刊,Quarterly,出版语言English,ISSN:0167-9260,E-ISSN:1872-7522。

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Integration-the Vlsi Journal
Integration-the Vlsi Journal
Integration-the Vlsi Journal
SCI SCIE

杂志介绍

JCR分区
Q3
中科院分区
3区
影响因子
2.6
CiteScore
5.1
期刊收录
SCI、SCIE

Integration-the Vlsi Journal(中文译名:《集成-Vlsi Journal》),ISSN:0167-9260,EISSN:1872-7522,是Elsevier出版的国际性学术期刊,创刊于1983年,以Quarterly形式稳定发行,2026年总发文量约250篇。该刊采用非OA开放访问,学科归属为工程技术 - 工程:电子与电气。该刊是工程技术、计算机硬件领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)等国际主流学术数据库收录。2026年期刊影响因子达2.6,2025年期刊CiteScore为5.1,2025年期刊自引率约11.5%,在中科院期刊分区体系中位列工程技术大类3区,在所属学科领域具备高学术影响力与国际认可度。Integration-the Vlsi Journal长期聚焦工程技术、计算机硬件及相关产业的技术应用前沿,平均审稿周期>12周,或约稿,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对工程技术、计算机硬件领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,CHINA MAINLANDIndia、USA、Iran、Italy、GERMANY (FED REP GER)、South Korea等为核心发文国家与地区;INDIAN INSTITUTE OF TECHNOLOGY SYSTEM (IIT SYSTEM)NATIONAL INSTITUTE OF TECHNOLOGY (NIT SYSTEM)、UNIVERSITY OF CALIFORNIA SYSTEM、CHINESE ACADEMY OF SCIENCES、POLYTECHNIC UNIVERSITY OF TURIN、UNIVERSITY OF ELECTRONIC SCIENCE & TECHNOLOGY OF CHINA、BOGAZICI UNIVERSITY等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件
3区 4区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
4区 4区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 36 / 60

40.8

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 194 / 369

47.6

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 37 / 61

40.16

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 182 / 371

51.08

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 35 / 60

42.5

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 184 / 368

50.1

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 36 / 60

40.83

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 170 / 368

53.94


中国学者近期发文

1
Low-complexity baseband harmonic cancellation digital predistortion technique for HF transmitter

Author:Ren, Jijun; Liu, Yukun; Wang, Xing; Li, Yikai; Wu, Mian; Wang, Chenyang

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102716

2
A dual-neuron second-order memristor-based Hopfield neural network with controllable extreme multistability and its application in image encryptio

Author:Wang, Yan; Yin, Kangdi; Jin, Jie; Li, Hongyan

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102731

3
MT-PUF: A reconfigurable intrinsic PUF for MRAM TCAM achieving 0.07%/10 °C and 0.44%/0.1 V sensitivit

Author:Ren, Shimao; Wang, Pengjun; Li, Xiangyu; Chen, Bo; Yang, Xinrong; Cai, Yongbin

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102726

4
YOLO-CMDS: An enhanced method for PCB defect detectio

Author:Xu, Junpeng; Shi, Lei; Yang, Wenqiang; Zhu, Xiangbo; Li, Jin; Wang, Yu

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102732

5
A side-channel attack (SCA)-resistant and reconfigurable cryptographic engine design for multiple hash algorithm

Author:Wang, Jinghe; Liu, Wenrui; Cheng, Jiafeng; Sun, Nengyuan; Pan, Zhiyuan; Niu, Zhaoyi; Li, Jianghong; Shi, Kai; Wang, Jiaqi; Zhang, Jiawei; Wang, Linhan; Song, Kangning; Xia, Tianyu; Yu, Haoxiang; Yu, Weize

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102736

6
Thermal optimization of analog ICs via transistor-array placemen

Author:Jia, Longtao; Huang, Zhihui; Meng, Qingduan; Wang, Jun; Li, Mingyu; Qiao, Fei; Liu, Bo

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102719

7
Cooperative control of multi-scroll attractors in chaotic neural network with double potential wells and staircase wells and its application in image encryptio

Author:Jin, Jie; Liu, Lin; Zhao, Lv; Yu, Fei

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102739

8
Archive-driven reinforcement learning for FPGA logic optimizatio

Author:Zhu, Junhan; Xu, Zhongyan; Fan, Jicong; Cheng, Xijun; Yu, Zhiguo; Gu, Xiaofeng

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102742

9
Cost-aware test pattern ordering for VLSI using an enhanced LSTNet architectur

Author:Geng, Bintao; Sun, Ying; Song, Tai; Li, Yadong

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102741

10
An effective test-per-clock test scheme based on dynamically-partitioned reconfigurable scan chain

Author:Liu, Tieqiao; Qian, Chao; Song, Yijun

Journal: INTEGRATION-THE VLSI JOURNAL. 2026; Vol. 109, Issue , pp. -. DOI: 10.1016/j.vlsi.2026.102727


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Integration-the Vlsi Journal

国际简称:INTEGRATION参考译名:集成-Vlsi Journal

年发文量:250 CiteScore:5.1 是否预警:否 Gold OA文章占比:7.25% 研究类文章占比:98.80%

杂志社联系方式:ELSEVIER SCIENCE BV, PO BOX 211, AMSTERDAM, NETHERLANDS, 1000 AE

Integration-the Vlsi Journal