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Journal Of Micromechanics And Microengineering

Journal Of Micromechanics And Microengineering杂志,由IOP Publishing Ltd.出版,于1991年创刊,Monthly,出版语言English,ISSN:0960-1317,E-ISSN:1361-6439。

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Journal Of Micromechanics And Microengineering
Journal Of Micromechanics And Microengineering
Journal Of Micromechanics And Microengineering
SCI SCIE EI

杂志介绍

JCR分区
Q2
中科院分区
4区
影响因子
2.5
CiteScore
4.4
期刊收录
SCI、SCIE、EI

Journal Of Micromechanics And Microengineering(中文译名:《微机械与微工程杂志》),ISSN:0960-1317,EISSN:1361-6439,是IOP Publishing Ltd.出版的国际性学术期刊,创刊于1991年,以Monthly形式稳定发行,2026年总发文量约160篇。该刊采用非OA开放访问,学科归属为工程技术 - 材料科学:综合。该刊是工程技术、工程电子与电气领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达2.5,2025年期刊CiteScore为4.4,2025年期刊自引率约8%,在中科院期刊分区体系中位列工程技术大类4区,在所属学科领域具备高学术影响力与国际认可度。Journal Of Micromechanics And Microengineering长期聚焦工程技术、工程电子与电气及相关产业的技术应用前沿,平均审稿周期约2.8个月,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对工程技术、工程电子与电气领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,CHINA MAINLANDUSA、Japan、India、South Korea、GERMANY (FED REP GER)、Canada等为核心发文国家与地区;CHINESE ACADEMY OF SCIENCESINDIAN INSTITUTE OF TECHNOLOGY SYSTEM (IIT SYSTEM)、UNIVERSITY OF CALIFORNIA SYSTEM、XI'AN JIAOTONG UNIVERSITY、ZHEJIANG UNIVERSITY、SHANGHAI JIAO TONG UNIVERSITY、DALIAN UNIVERSITY OF TECHNOLOGY等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 INSTRUMENTS & INSTRUMENTATION 仪器仪表 PHYSICS, APPLIED 物理:应用
4区 4区 4区 4区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理:应用
4区 4区 4区 4区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理:应用
4区 4区 4区 4区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 204 / 369

44.9

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 39 / 81

52.5

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 109 / 148

26.7

学科:PHYSICS, APPLIED SCIE Q3 114 / 191

40.6

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 226 / 371

39.22

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q3 50 / 81

38.89

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 93 / 148

37.5

学科:PHYSICS, APPLIED SCIE Q3 118 / 191

38.48

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 214 / 368

42

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q3 43 / 79

46.2

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q4 116 / 147

21.4

学科:PHYSICS, APPLIED SCIE Q3 123 / 187

34.5

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 206 / 368

44.16

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q3 47 / 79

41.14

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 88 / 147

40.48

学科:PHYSICS, APPLIED SCIE Q3 110 / 187

41.44


中国学者近期发文

1
Research on femtosecond laser direct writing-based thermally induced shrinkage proces

Author:Xie, Yu; Liu, Yongkang; Chen, Jianxiong; Chen, Hui; Hong, Shujin

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 4, pp. -. DOI: 10.1088/1361-6439/ae4ef7

2
On-wafer compression test method with endogenous mechanical compensation mechanism for buckling behaviour and etching quality characterizatio

Author:Chen, Yi; Zhang, Dacheng

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 4, pp. -. DOI: 10.1088/1361-6439/ae5666

3
A novel friction test device for nanoscale gap surfaces with sandwiched lubrican

Author:Yagi, Wataru; Xia, Yuanlin; Tsuchiya, Toshiyuki; Yamashita, Naoki; Hirayama, Tomoko

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 4, pp. -. DOI: 10.1088/1361-6439/ae54a2

4
Fabrication and characterization of Cu/GO composite microcomponents via jet electrodepositio

Author:Li, Aoxiang; Xi, Yuntao; Zhou, Bo; Lei, Yudong; Ren, Li; Pan, Bowei; Xie, Longfei; Wang, Tingli; Su, Bo

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 4, pp. -. DOI: 10.1088/1361-6439/ae597e

5
Heterogeneously integrated chain-type micro thermoelectric generator enabled by shared-via LTCC technolog

Author:Tian, Xueqing; Chen, Qing; Niu, Xinrui; Xu, Jianren; Wei, Li; Dai, Bo; Zhang, Dawei; Di, Zhixiong; Wang, Ning

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 3, pp. -. DOI: 10.1088/1361-6439/ae54a1

6
An improved Bi-LSTM framework based on DWT-MTF-2DCNN for multi-condition temperature prediction in microchannel heat exchange

Author:Su, Tianyi; Chen, Lei; Ma, Yuanyuan; Wu, Wenzhuo; Li, Jin

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 3, pp. -. DOI: 10.1088/1361-6439/ae4a31

7
Characteristic of LiNbO3 thin film ICP etching for micro/nano fabricatio

Author:Huang, Yantao; Liu, Yushuai; Wu, Tao

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 3, pp. -. DOI: 10.1088/1361-6439/ae36b6

8
Temperature compensation of surface acoustic wave strain sensors on 122° X-cut lithium tantalate substrate at high temperature

Author:Yang, Gaoshang; Wang, Yuexing; Yang, Zhengzhong; Sun, Xiangyu; Yao, Yao

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 3, pp. -. DOI: 10.1088/1361-6439/ae4e38

9
Modeling and simulation of capacitive nanoelectromechanical pressure sensors based on suspended graphene membrane

Author:Liu, Quan; Zhang, Zhe; Si, Fangcheng; Ding, Jie; Zhange, Wendong; Fan, Xuge

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 3, pp. -. DOI: 10.1088/1361-6439/ae4ef8

10
Inverse design of MEMS micro-beam resonators using physics-guided machine learning framewor

Author:Wei, Feixuan; Lyu, Ming; Luo, Zhengyang; Zha, Zhikun; Quan, Yuheng; Kacem, Najib

Journal: JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2026; Vol. 36, Issue 3, pp. -. DOI: 10.1088/1361-6439/ae519c


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Journal Of Micromechanics And Microengineering

国际简称:J MICROMECH MICROENG参考译名:微机械与微工程杂志

年发文量:160 CiteScore:4.4 是否预警:否 Gold OA文章占比:55.53% 研究类文章占比:96.25%

杂志社联系方式:IOP PUBLISHING LTD, DIRAC HOUSE, TEMPLE BACK, BRISTOL, ENGLAND, BS1 6BE

Journal Of Micromechanics And Microengineering