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Journal Of Microelectromechanical Systems

Journal Of Microelectromechanical Systems杂志,由Institute of Electrical and Electronics Engineers Inc.出版,于1992年创刊,Bimonthly,出版语言English,ISSN:1057-7157,E-ISSN:1941-0158。

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Journal Of Microelectromechanical Systems
Journal Of Microelectromechanical Systems
Journal Of Microelectromechanical Systems
SCI SCIE EI

杂志介绍

JCR分区
Q2
中科院分区
3区
影响因子
3.5
CiteScore
6.3
期刊收录
SCI、SCIE、EI

Journal Of Microelectromechanical Systems(中文译名:《微机电系统杂志》),ISSN:1057-7157,EISSN:1941-0158,是Institute of Electrical and Electronics Engineers Inc.出版的国际性学术期刊,创刊于1992年,以Bimonthly形式稳定发行,2026年总发文量约104篇。该刊采用非OA开放访问,学科归属为工程技术 - 工程:电子与电气。该刊是工程技术、工程电子与电气领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达3.5,2025年期刊CiteScore为6.3,2025年期刊自引率约11.4%,在中科院期刊分区体系中位列工程技术大类3区,在所属学科领域具备高学术影响力与国际认可度。Journal Of Microelectromechanical Systems长期聚焦工程技术、工程电子与电气及相关产业的技术应用前沿,平均审稿周期约3.0个月,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对工程技术、工程电子与电气领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,USACHINA MAINLAND、Canada、GERMANY (FED REP GER)、India、Japan、Italy等为核心发文国家与地区;UNIVERSITY OF CALIFORNIA SYSTEMSTATE UNIVERSITY SYSTEM OF FLORIDA、STANFORD UNIVERSITY、CARNEGIE MELLON UNIVERSITY、SOUTHEAST UNIVERSITY - CHINA、UNIVERSITY OF ILLINOIS SYSTEM、CHINESE ACADEMY OF SCIENCES等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 INSTRUMENTS & INSTRUMENTATION 仪器仪表 PHYSICS, APPLIED 物理:应用
3区 4区 3区 3区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 NANOSCIENCE & NANOTECHNOLOGY 纳米科技 PHYSICS, APPLIED 物理:应用
3区 3区 3区 3区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 INSTRUMENTS & INSTRUMENTATION 仪器仪表 PHYSICS, APPLIED 物理:应用 NANOSCIENCE & NANOTECHNOLOGY 纳米科技
3区 3区 3区 4区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 148 / 369

60

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 30 / 81

63.6

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 88 / 148

40.9

学科:PHYSICS, APPLIED SCIE Q2 75 / 191

61

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 165 / 371

55.66

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 34 / 81

58.64

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q2 70 / 148

53.04

学科:PHYSICS, APPLIED SCIE Q2 72 / 191

62.57

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 152 / 368

58.8

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 29 / 79

63.9

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q3 91 / 147

38.4

学科:PHYSICS, APPLIED SCIE Q2 75 / 187

60.2

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 167 / 368

54.76

学科:INSTRUMENTS & INSTRUMENTATION SCIE Q2 35 / 79

56.33

学科:NANOSCIENCE & NANOTECHNOLOGY SCIE Q2 72 / 147

51.36

学科:PHYSICS, APPLIED SCIE Q2 77 / 187

59.09


中国学者近期发文

1
MEMS Microheater With Fast Electrothermal Response for Self-Destructing Chip Application

Author:He, Haoran; Ma, Wanli; Fan, Zhiqiang; Xu, Kai; Kang, Zhiqiang; Zhao, Wei; Zhang, Le; Qiao, Xiaojun; Geng, Wenping

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3674741

2
A Novel Comprehensive Parametric Macromodeling Method for MEMS Sensors Based on the Reduced-Order State-Space Models and Machine Learning Approache

Author:Xu, Hao; Mo, Yun-Cong; Zhang, Hao-Dong; Wen, Jun-Jie; Zhou, Zai-Fa; Huang, Qing-An

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3677815

3
A Nano-g MEMS Accelerometer With Electrostatic Anti-Spring Based on SOI Technolog

Author:Cao, Jianxia; Cao, Kangda; Zhou, Yang; Pei, Zhe; Ouyang, Hao; Zhao, Kunwei; Zhang, Shaolin; Yu, Kan; Wu, Wenjie; Liu, Huafeng; Liu, Jinquan

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3676738

4
Analysis of Brittle Fracture Characteristics Under Static/Dynamic Loads in Silicon-Based MEMS Cantilever

Author:Yang, Mo; Cheng, Baolin; Nie, Weirong; Shi, Mingyuyi; Lei, Shenghong; Wang, He; Dai, Shijuan; Cao, Yun

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3679568

5
A Novel Optimization and Yield Analysis Method for MEMS Devices Combining Bi-Fidelity Deep Neural Network and Active Subspac

Author:Zhao, Lin-Feng; Liu, Gong-Zeng; Mo, Yun-Cong; Wang, He; Huang, Qing-An; Zhou, Zai-Fa

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3667598

6
Low-Loss and Ultra-Wideband SAW Filters Using LiNbO3/Si Structur

Author:Xu, Qiufeng; Shen, Junyao; Xie, Shouren; Shen, Quhuan; Pan, Feng

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3669513

7
A Lithium Niobate Piezoelectric Micromachined Ultrasonic Transducer Operating in Thickness-Field-Excitation ModeWith Enhanced Acoustic Emissio

Author:Liu, Zhiquan; Le, Xianhao; Wang, Xiongfeng; Jiang, Yang; Wan, Qing; Xu, Wei; Mao, Junfa; Liao, Wugang; Gao, Feng

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3668053

8
Two-Dimensional Modeling for Parametric Optimization and Crosstalk Analysis of Dual-Axis Micro Thermal Convective Tilt Sensor

Author:Luo, Huahuang; Peng, Tingfeng; Lu, Zihan; Xu, Hongxin; Wang, Yuan; Kraft, Michael; Wang, Chen; Ke, Qingqing

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3672086

9
The Research of a Miniaturized Ammunition With Built-In MEMS Safety-and-Arming Device for Micro Drone

Author:Hu, Tengjiang; Zhao, Yulong; Li, Guilin; Liu, Jiakai

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3654925

10
Vertically-Excited High-Order Guided Shear Vertical Surface Acoustic Wave Resonators for 5G and Beyon

Author:Fang, Xiaoli; Wu, Jinbo; Zheng, Pengcheng; Ke, Xinjian; He, Juxing; Sun, Mijing; Huang, Kai; Zhang, Shibin; Ou, Xin

Journal: JOURNAL OF MICROELECTROMECHANICAL SYSTEMS. 2026; Vol. , Issue , pp. -. DOI: 10.1109/JMEMS.2026.3654965


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Journal Of Microelectromechanical Systems

国际简称:J MICROELECTROMECH S参考译名:微机电系统杂志

年发文量:104 CiteScore:6.3 是否预警:否 Gold OA文章占比:6.69% 研究类文章占比:100.00%

杂志社联系方式:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

Journal Of Microelectromechanical Systems