发文地区与机构
近年国家 / 地区发文量统计
| 国家 / 地区 | 发文量 |
|---|---|
| CHINA MAINLAND | 31 |
| Malaysia | 19 |
| Hungary | 13 |
| Poland | 11 |
| USA | 9 |
| Czech Republic | 8 |
| India | 7 |
| Pakistan | 6 |
| Taiwan | 5 |
| GERMANY (FED REP GER) | 3 |
近年机构发文量统计
| 机构 | 发文量 |
|---|---|
| BUDAPEST UNIVERSITY OF TECHNOLOGY & ECO... | 13 |
| UNIVERSITI SAINS MALAYSIA | 11 |
| CZECH TECHNICAL UNIVERSITY PRAGUE | 7 |
| UNIVERSITI KEBANGSAAN MALAYSIA | 7 |
| AGH UNIVERSITY OF SCIENCE & TECHNOLOGY | 6 |
| HARBIN UNIVERSITY OF SCIENCE & TECHNOLO... | 4 |
| UNIVERSITY OF MALAYSIA PERLIS | 4 |
| AGRICULTURAL UNIVERSITY PESHAWAR | 3 |
| BEIJING UNIVERSITY OF TECHNOLOGY | 3 |
| CAPITAL UNIV SCI & TECHNOL | 3 |
文章引用情况
1
Design of a bi-manual haptic interface for skill acquisition in surface mount device soldering2
Characterization of SAC - x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly3
Applying data mining methodology to establish an intelligent decision system for PCBA process4
Transient liquid phase bonding in the Cu-Sn system5
Study on the strength of diameter-reducing solder balls by shear and pull tests6
Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry7
Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding8
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint9
Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability10
Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder