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Ieee Transactions On Components Packaging And Manufacturing Technology

Ieee Transactions On Components Packaging And Manufacturing Technology杂志,由Institute of Electrical and Electronics Engineers Inc.出版,于2011年创刊,12 issues/year,出版语言English,ISSN:2156-3950,E-ISSN:2156-3985。

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Ieee Transactions On Components Packaging And Manufacturing Technology
Ieee Transactions On Components Packaging And Manufacturing Technology
Ieee Transactions On Components Packaging And Manufacturing Technology
SCI SCIE

发文地区与机构

近年国家 / 地区发文量统计

国家 / 地区 发文量
USA 226
CHINA MAINLAND 208
Taiwan 71
South Korea 51
GERMANY (FED REP GER) 49
India 47
Japan 46
Canada 40
England 24
France 22

文章引用情况

1
Multi-Physics Modeling and Characterization of Components on Flexible Substrates

引用次数:5

2
Innovative Sub-5-mu m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects

引用次数:5

3
An Improved Ultrawideband Open-Short De-Embedding Method Applied up to 220 GHz

引用次数:5

4
A Scalable and Multidirectional Rectenna System for RF Energy Harvesting

引用次数:5

5
Broadband Filtering Power Dividers Using Simple Three-Line Coupled Structures

引用次数:5

6
Very Sharp Roll-Off Ultrawide Stopband Low-Pass Filter Using Modified Flag Resonator

引用次数:5

7
Expected Failures in 3-D Technology and Related Failure Analysis Challenges

引用次数:5

8
Hybrid Cooling System for Electronics Equipment During Power Surge Operation

引用次数:5

9
Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life

引用次数:5

10
Design and Analysis of the DC-DC Converter With a Frequency Hopping Technique for EMI Reduction

引用次数:4