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Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems杂志,由Institute of Electrical and Electronics Engineers Inc.出版,于1982年创刊,Monthly,出版语言English,ISSN:0278-0070,E-ISSN:1937-4151。

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Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems
Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems
Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems
SCI SCIE EI

杂志介绍

JCR分区
Q2
中科院分区
3区
影响因子
3.6
CiteScore
7.2
期刊收录
SCI、SCIE、EI

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems(中文译名:《集成电路和系统的计算机辅助设计IEEE Transactions》),ISSN:0278-0070,EISSN:1937-4151,是Institute of Electrical and Electronics Engineers Inc.出版的国际性学术期刊,创刊于1982年,以Monthly形式稳定发行,2026年总发文量约385篇。该刊采用非OA开放访问,学科归属为工程技术 - 工程:电子与电气。该刊是计算机科学、计算机硬件领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达3.6,2025年期刊CiteScore为7.2,2025年期刊自引率约8.3%,在中科院期刊分区体系中位列计算机科学大类3区,在所属学科领域具备高学术影响力与国际认可度。Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems长期聚焦计算机科学、计算机硬件及相关产业的技术应用前沿,平均审稿周期一般,3-8周,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对计算机科学、计算机硬件领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,USACHINA MAINLAND、Taiwan、GERMANY (FED REP GER)、South Korea、India、France等为核心发文国家与地区;UNIVERSITY OF CALIFORNIA SYSTEMTSINGHUA UNIVERSITY、DUKE UNIVERSITY、CHINESE UNIVERSITY OF HONG KONG、UNIVERSITY OF TEXAS SYSTEM、CHINESE ACADEMY OF SCIENCES、INDIAN INSTITUTE OF TECHNOLOGY SYSTEM (IIT SYSTEM)等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区 3区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区 3区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
3区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS 计算机:跨学科应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
3区 3区 3区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 23 / 60

62.5

学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q2 89 / 185

52.2

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 142 / 369

61.7

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 31 / 61

50

学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q3 98 / 185

47.3

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 150 / 371

59.7

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 24 / 60

60.8

学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q3 90 / 177

49.4

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 162 / 368

56.1

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q2 26 / 60

57.5

学科:COMPUTER SCIENCE, INTERDISCIPLINARY APPLICATIONS SCIE Q2 80 / 177

55.08

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q2 144 / 368

61.01


中国学者近期发文

1
A Full-Stack Framework for GNN Acceleration via Partition-Compiler-Architecture Co-Desig

Author:Zhou, Yangjie; Zhang, Zhihui; Lu, Shuwen; Guo, Cong; Leng, Jingwen; Zhang, Feng; Ma, Yufei; Liang, Yun; Guo, Minyi

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2348-2361. DOI: 10.1109/TCAD.2025.3610582

2
Efficient Instruction Fusion for ASIPs: A Low-Cost Approach to Structural Hazard Contro

Author:Zhou, Xinbing; Liu, Tianlang; Tang, Tiancheng; Man, Yi; Hao, Peng; Chen, Wei; Liu, Dake

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2418-2431. DOI: 10.1109/TCAD.2025.3611113

3
ACE-GNN: Adaptive GNN Co-Inference With System-Aware Scheduling in Dynamic Edge Environment

Author:Zhou, Ao; Yang, Jianlei; Qiao, Tong; Qi, Yingjie; Wei, Xinming; Duan, Cenlin; Zhao, Weisheng; Hu, Chunming

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2334-2347. DOI: 10.1109/TCAD.2025.3617863

4
Registry: Enhancing Vertex Reusability for GCN Inference on Hybrid Stacked Memor

Author:Zhong, Zhaoyu; Chen, Jiaxian; Dong, Yunhao; Wang, Tianyu; Ma, Chenlin; Mao, Rui; Wang, Yi

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2376-2389. DOI: 10.1109/TCAD.2025.3612868

5
Terafly: A Multinode FPGA-Based Accelerator Design for Efficient Cooperative Inference in LLM

Author:Zheng, Jianing; Chen, Gang; Huang, Libo; Lou, Xin; Zheng, Wei-Shi

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2446-2459. DOI: 10.1109/TCAD.2025.3616078

6
Safe Reinforcement Learning for NN-Controlled Systems With Neural Barrier Certificate Guidanc

Author:Zhao, Hanrui; Ren, Mengxin; Liu, Banglong; Qi, Niuniu; Zeng, Xia; Zeng, Zhenbing; Yang, Zhengfeng

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2460-2473. DOI: 10.1109/TCAD.2025.3616856

7
A Photonic Interconnect Enabling Cross-Layer Scheduling for Chiplet-Based DNN Accelerator

Author:Zhang, Yubo; Ye, Yaoyao

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2123-2135. DOI: 10.1109/TCAD.2025.3593438

8
MUXLeak: Exploiting Multiplexers as a Power Side Channel Against Multitenant FPGA

Author:Zhang, Xin; Zou, Jiajun; Zhang, Zhi; Shen, Qingni; Gao, Yansong; Cui, Jinhua; Feng, Yusi; Wu, Zhonghai; Abbott, Derek

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2280-2293. DOI: 10.1109/TCAD.2025.3611878

9
Frequency-Domain Modeling of Interconnects Based on Assemble Neural Network for 3-D Integratio

Author:Ye, Zi-Xing; Wang, Da-Wei; Zhao, Wen-Sheng; Lin, Xuan; Zhu, Nengyong; Tang, Min; Liu, Jun; Sun, Lingling

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2208-2221. DOI: 10.1109/TCAD.2025.3614103

10
ESFA: An Efficient Scalable FFT Design Framework on Versal AI Engin

Author:Yang, Hao; Du, Linfeng; Li, Shangkun; Zhang, Wei

Journal: IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 2026; Vol. 45, Issue 5, pp. 2321-2333. DOI: 10.1109/TCAD.2025.3612333


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Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems

国际简称:IEEE T COMPUT AID D参考译名:集成电路和系统的计算机辅助设计IEEE Transactions

年发文量:385 CiteScore:7.2 是否预警:否 Gold OA文章占比:4.20% 研究类文章占比:100.00%

杂志社联系方式:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

Ieee Transactions On Computer-aided Design Of Integrated Circuits And Systems