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Microelectronics International

Microelectronics International杂志,由Emerald Group Publishing Ltd.出版,于1982年创刊,Tri-annual,出版语言English,ISSN:1356-5362,E-ISSN:1758-812X。

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Microelectronics International
Microelectronics International
Microelectronics International
SCI SCIE EI

杂志介绍

JCR分区
Q4
中科院分区
4区
影响因子
1
CiteScore
2.6
期刊收录
SCI、SCIE、EI

Microelectronics International(中文译名:《微电子国际》),ISSN:1356-5362,EISSN:1758-812X,是Emerald Group Publishing Ltd.出版的国际性学术期刊,创刊于1982年,以Tri-annual形式稳定发行,2026年总发文量约13篇。该刊采用混合开放访问,学科归属为工程技术 - 材料科学:综合。该刊是工程技术、工程电子与电气领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达1,2025年期刊CiteScore为2.6,2025年期刊自引率约0%,在中科院期刊分区体系中位列工程技术大类4区,在所属学科领域具备高学术影响力与国际认可度。Microelectronics International长期聚焦工程技术、工程电子与电气及相关产业的技术应用前沿,平均审稿周期>12周,或约稿,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对工程技术、工程电子与电气领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,PolandMalaysia、CHINA MAINLAND、India、GERMANY (FED REP GER)、Iran、Argentina等为核心发文国家与地区;UNIVERSITI SAINS MALAYSIASILESIAN UNIVERSITY OF TECHNOLOGY、UNIVERSITI KEBANGSAAN MALAYSIA、WROCLAW UNIVERSITY OF SCIENCE & TECHNOLOGY、WARSAW UNIVERSITY OF TECHNOLOGY、AGH UNIVERSITY OF SCIENCE & TECHNOLOGY、HELIOENERGIA SP ZOO等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合
4区 4区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合
4区 4区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合
4区 4区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q4 321 / 369

13.1

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q4 425 / 472

10.1

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q4 336 / 371

9.57

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q4 430 / 473

9.2

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q4 318 / 368

13.7

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q4 419 / 461

9.2

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q4 334 / 368

9.38

学科:MATERIALS SCIENCE, MULTIDISCIPLINARY SCIE Q4 418 / 463

9.83


中国学者近期发文

1
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics couplin

Author:Wang, Yuqi; Yao, Ran; Li, Hui; Lai, Wei; Yuan, Wenqian; Ji, Yirun; Huai, Qing; Yuan, Xi; Jie, Ziyao

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. 43, Issue 2, pp. 38-50. DOI: 10.1108/MI-08-2025-0164

2
Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguid

Author:Zhang, Tao; Zou, Danqing; Meng, Fan-Yi; Wang, Yuxin; Sun, Hongpeng; Fu, Jia-Hui; Ding, Chang

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-07-2025-0129

3
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joint

Author:Liu, Yun-Xin; Zhang, Liang; Chen, Yu-Hao; Zhang, Jia-Min; Chen, Mo; Liu, Tao; Shi, Lei

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-12-2025-0267

4
Stress-strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loadin

Author:Liu, Xiaobin; Huang, Chunyue; Yang, Jinmei

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-11-2025-0231

5
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorith

Author:Liu, Xianjia; Huang, Long; Huang, Chunyue; Chen, Yonglin; Liang, Ying; Gao, Chao; Wu, Liye; Cao, Zhiqin

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-07-2025-0130

6
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedbac

Author:Jiang, Kezheng; Ao, Yuqi; Zhao, Yifan; Xiong, Ping; Ding, Hao; Zhou, Yi

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-07-2025-0123

7
Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling load

Author:Yang, Xuexia; Zhu, Miao; Sun, Yanxi; Lin, Jinbao; Hao, Xin; Shu, Xuefeng; Xiao, Gesheng

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-06-2025-0120

8
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind powe

Author:Wang, Yanfeng; Peng, Sui; Fu, Yan; He, Lingfeng; Huang, Jun; Yang, Lingyun; Huang, Zhicong

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-06-2025-0105

9
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converter

Author:Yang, Juefei; Wang, Yunfei; Mo, Ze; Ouyang, Liangxuan; Zhang, Qingyu; Fang, Yan; Zhao, Zhaoyang

Journal: MICROELECTRONICS INTERNATIONAL. 2026; Vol. , Issue , pp. -. DOI: 10.1108/MI-04-2025-0052

10
Investigation of Au-Si eutectic wafer bonding for small-cavity MEMS device

Author:Liu, Botao; Wang, Yawei; Zhao, Junyuan; Yang, Xin; Wu, Zeyu; Niu, Bo; Hong, Yiyi; Cui, Weibin; Zhu, Yinfang; Cao, Lixin

Journal: MICROELECTRONICS INTERNATIONAL. 2025; Vol. , Issue , pp. -. DOI: 10.1108/MI-01-2025-0004


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Microelectronics International

国际简称:MICROELECTRON INT参考译名:微电子国际

年发文量:13 CiteScore:2.6 是否预警:否 Gold OA文章占比:0.00% 研究类文章占比:100.00%

杂志社联系方式:EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA

Microelectronics International