Microelectronics Reliability

Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology

IGBT junction and coolant temperature estimation by thermal model

Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

Metallized film capacitors used for EMI filtering: A reliability review

The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface

An artificial neural network approach for wafer dicing saw quality prediction

Failure and failure characterization of QFP package interconnect structure under random vibration condition

A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions

Effect of aging on mechanical properties of high temperature Pb-rich solder joints

Design, manufacture and test for reliable 3D printed electronics packaging