Ieee Transactions On Device And Materials Reliability

Efficient Output Power Enhancement and Protection Technique for Hot Spotted Solar Photovoltaic Modules

Life Model of the Electrochemical Migration Failure of Printed Circuit Boards Under NaCl Solution

Probing Plasticity and Strain-Rate Effects of Indium Submicron Pillars Using Synchrotron Laue X-Ray Microdiffraction

Temporally- and Spatially-Resolved Observations of Current Filament Dynamics in Insulated Gate Bipolar Transistor Chip During Avalanche Breakdown

Self-Heating Assessment on Bulk FinFET Devices Through Characterization and Predictive Simulation

Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite-Element Analysis

The Impact of Fin Number on Device Performance and Reliability for Multi-Fin Tri-Gate n- and p-Type FinFET

Analysis of the Significant Rise in Breakdown Voltage of GaN HEMTs From Near-Threshold to Deep Off-State Gate Bias Conditions

Circuit-Level Technique to Design Variation- and Noise-Aware Reliable Dynamic Logic Gates

Elimination of Scallop-Induced Stress Fluctuation on Through-Silicon-Vias (TSVs) by Employing Polyimide Liner