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Ieee Transactions On Reliability

Ieee Transactions On Reliability杂志,由Institute of Electrical and Electronics Engineers Inc.出版,于1963年创刊,Quarterly,出版语言English,ISSN:0018-9529,E-ISSN:1558-1721。

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Ieee Transactions On Reliability
Ieee Transactions On Reliability
Ieee Transactions On Reliability
SCI SCIE EI

杂志介绍

JCR分区
Q1
中科院分区
2区
影响因子
5.4
CiteScore
10
期刊收录
SCI、SCIE、EI

Ieee Transactions On Reliability(中文译名:《可靠性交易》),ISSN:0018-9529,EISSN:1558-1721,是Institute of Electrical and Electronics Engineers Inc.出版的国际性学术期刊,创刊于1963年,以Quarterly形式稳定发行,2026年总发文量约188篇。该刊采用非OA开放访问,学科归属为工程技术 - 工程:电子与电气。该刊是计算机科学、计算机硬件领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达5.4,2025年期刊CiteScore为10,2025年期刊自引率约9.3%,在中科院期刊分区体系中位列计算机科学大类2区,在所属学科领域具备高学术影响力与国际认可度。Ieee Transactions On Reliability长期聚焦计算机科学、计算机硬件及相关产业的技术应用前沿,平均审稿周期约4.5个月,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对计算机科学、计算机硬件领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,CHINA MAINLANDUSA、England、Canada、France、Brazil、Italy等为核心发文国家与地区;BEIHANG UNIVERSITYCHINESE ACADEMY OF SCIENCES、CITY UNIVERSITY OF HONG KONG、NORTHWESTERN POLYTECHNICAL UNIVERSITY、EAST CHINA NORMAL UNIVERSITY、XI'AN JIAOTONG UNIVERSITY、HARBIN INSTITUTE OF TECHNOLOGY等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
1区 2区 2区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区 2区 2区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
2区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气
2区 2区 2区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 11 / 60

82.5

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 18 / 128

86.3

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 80 / 369

78.5

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 7 / 61

89.34

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 16 / 128

87.89

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 48 / 371

87.2

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 8 / 60

87.5

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 12 / 129

91.1

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 60 / 368

83.8

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q1 8 / 60

87.5

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q1 15 / 129

88.76

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q1 49 / 368

86.82


中国学者近期发文

1
Modeling and Estimation for Degradation Data With Initiation-Growth Correlation

Author:Wu, Wenhui; Wang, Bing Xing; Chen, Piao

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1377-1391. DOI: 10.1109/TR.2026.3673522

2
Precise 3-D Temperature Field Reconstruction of Automotive Aluminum Forging Dies Using Deep Learning and Heterogeneous Multiview Visio

Author:She, Yongshuo; Hu, Zeqi; Qi, Hongwei; Song, Rui; Hua, Lin; Chen, Yudong

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1365-1376. DOI: 10.1109/TR.2026.3663114

3
Generalized Fiducial Inference for Accelerated Life Tests With Failure-Free Life Based on Three-Parameter Weibull Distributio

Author:Miao, Zhuqing; Tian, Tianzi; Li, Yige; Yang, Jun

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1407-1419. DOI: 10.1109/TR.2026.3673919

4
Redundant Hierarchical Ring All-Reduce in Hypercube

Author:Guo, Huimei; Quan, Shuo; Hao, Rong-Xia; Wu, Jie

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1350-1364. DOI: 10.1109/TR.2026.3668208

5
A Hierarchical Bayesian Multivariate Wiener Process Model With Dependent Degradation Rates and Volatilitie

Author:Xu, Ancha; Miao, Yihang; Sun, Jiaxiang; Zhou, Shirong; Tang, Yincai

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1420-1433. DOI: 10.1109/TR.2026.3674703

6
Developing a Deep Reinforcement Learning-Based Framework for Identifying Vulnerable Neurons Across Deep Neural Network

Author:Su, Peng; Yan, Zihao; Chen, Dejiu

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1434-1443. DOI: 10.1109/TR.2026.3673605

7
InsightX Agent: An LMM-Based Agentic Framework With Integrated Tools for Reliable X-Ray NDT Analysi

Author:Liu, Jiale; Wang, Huan; Zhang, Yue; Luo, Xiaoyu; Hu, Jiaxiang; Liu, Zhiliang; Xie, Min

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1455-1468. DOI: 10.1109/TR.2026.3668946

8
Fusing Effective Channel Attention With Depthwise Separable Large Kernels for Bearing Fault Diagnosis Under Small Sample Condition

Author:Chen, Chuanhai; Huang, Xinguan; Jin, Tongtong; Liu, Zhifeng; Guo, Jinyan

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1444-1454. DOI: 10.1109/TR.2026.3673285

9
FD-TE Diagnosis: Enhancing Microservice Fault Diagnosis With Frequency Domain Features and Centrality-Aware Time Encodin

Author:Liu, Mingyu; Li, Yangfan; Wang, Haotian; Li, Minglong; Tang, Fengxiao; Yang, Wenjing

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1483-1495. DOI: 10.1109/TR.2026.3680212

10
Snake in the Grass: A Hybrid Detection Method Targeting Malicious PyPI Package

Author:Huang, Cheng; Zeng, Yutong; Liang, Genpei; Yang, Zhen; Du, Yutong

Journal: IEEE TRANSACTIONS ON RELIABILITY. 2026; Vol. 75, Issue , pp. 1540-1553. DOI: 10.1109/TR.2026.3676895


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Ieee Transactions On Reliability

国际简称:IEEE T RELIAB参考译名:可靠性交易

年发文量:188 CiteScore:10 是否预警:否 Gold OA文章占比:3.50% 研究类文章占比:98.94%

杂志社联系方式:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

Ieee Transactions On Reliability