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Ieee Embedded Systems Letters

Ieee Embedded Systems Letters杂志,由Institute of Electrical and Electronics Engineers Inc.出版,于2009年创刊,4 issues/year,出版语言English,ISSN:1943-0663,E-ISSN:1943-0671。

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Ieee Embedded Systems Letters
Ieee Embedded Systems Letters
Ieee Embedded Systems Letters
SCI SCIE EI

杂志介绍

JCR分区
Q3
中科院分区
4区
影响因子
1.7
CiteScore
4.1
期刊收录
SCI、SCIE、EI

Ieee Embedded Systems Letters(中文译名:《IEEE 嵌入式系统快报》),ISSN:1943-0663,EISSN:1943-0671,是Institute of Electrical and Electronics Engineers Inc.出版的国际性学术期刊,创刊于2009年,以4 issues/year形式稳定发行,2026年总发文量约109篇。该刊采用非OA开放访问,学科归属为Engineering - Control and Systems Engineering。该刊是计算机科学、计算机硬件领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达1.7,2025年期刊CiteScore为4.1,2025年期刊自引率约5.9%,在中科院期刊分区体系中位列计算机科学大类4区,在所属学科领域具备高学术影响力与国际认可度。Ieee Embedded Systems Letters长期聚焦计算机科学、计算机硬件及相关产业的技术应用前沿,在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对计算机科学、计算机硬件领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,USAIndia、GERMANY (FED REP GER)、CHINA MAINLAND、Italy、South Korea、France等为核心发文国家与地区;INDIAN INSTITUTE OF TECHNOLOGY SYSTEM (IIT SYSTEM)UNIVERSITY OF CALIFORNIA SYSTEM、UNIVERSITA DELLA SVIZZERA ITALIANA、POLYTECHNIC UNIVERSITY OF MILAN、UNIVERSITY OF PADERBORN、UNIVERSITY OF STUTTGART、CECOS UNIV IT & EMERGING SCI等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
4区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程
4区 4区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
4区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程
4区 4区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
计算机科学
4区
COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件 COMPUTER SCIENCE, SOFTWARE ENGINEERING 计算机:软件工程
4区 4区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q4 48 / 60

20.8

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q3 85 / 128

34

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 43 / 61

30.33

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q3 85 / 128

33.98

2023-2024年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 44 / 59

26.3

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q3 73 / 131

44.7

学科:COMPUTER SCIENCE, HARDWARE & ARCHITECTURE SCIE Q3 37 / 59

38.14

学科:COMPUTER SCIENCE, SOFTWARE ENGINEERING SCIE Q3 83 / 131

37.02


中国学者近期发文

1
Compressing Runtime Memory Usage via Activation Remapping for Deploying Deep Neural Networks on MCU

Author:Zhan, Jinyu; Wang, Xiang; Jiang, Wei; Peng, Suidi

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 2, pp. 94-98. DOI: 10.1109/LES.2025.3571799

2
FSMA: Fine-Grained Interlayer Scheduling and Mapping Co-Exploration Framework for Chiplet-Based DNN Accelerator

Author:Lu, Tao; Zhang, Yongchang; Wang, Peilin; Huang, Haiqiu; Ye, Zhirong; Wang, Mingyu

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 2, pp. 152-155. DOI: 10.1109/LES.2025.3590369

3
Software-Hardware Exploration of Early-Exit Neural Networks on Edge Accelerator

Author:Gong, Qianying; Duan, Biqing; Miao, Shengfa; He, Zhenli; Liu, Di

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 2, pp. 136-139. DOI: 10.1109/LES.2025.3573404

4
A Quantitative Security Ranking Method of PUF Based on the Rademacher Complexity of PUF

Author:Deng, Xuexiang; Cui, Xiaole; Zhang, Xing

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 2, pp. 119-122. DOI: 10.1109/LES.2025.3586724

5
An Agile Systolic Array-Based Hardware Accelerator for Scalable Multi-Head Self-Attentio

Author:Chen, Xinyu; Li, Yu; Zhao, Beining; Liu, Yintao; Cao, Shan; Jiang, Zhiyuan

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 2, pp. 90-93. DOI: 10.1109/LES.2025.3595586

6
A High-Speed ASIC Design of Reed-Solomon Erasure Code (RS-EC) Decoders for Fast Data Recovery in Storag

Author:Wang, Jiaqi; Zhao, Hongyang; Cheng, Jiafeng; Liu, Wenrui; Sun, Nengyuan; Sha, Heng; Pan, Zhiyuan; Jin, Ming; Wang, Jinghe; Niu, Zhaoyi; Li, Jianghong; Shi, Kai; Zhang, Jiawei; Wang, Linhan; Song, Kangning; Li, Ke; Kose, Selcuk; Yu, Weize

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 1, pp. 11-14. DOI: 10.1109/LES.2025.3566686

7
Two Novel Approximate Radix-4 Booth Encoders for Efficient Signed Approximate Booth Multiplier

Author:Tang, Xiqin; Li, Yang; Liu, Weijia; Shang, Delong

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 1, pp. 73-76. DOI: 10.1109/LES.2025.3567482

8
Hybrid Storage Class Memory-Enhanced Machine Learning Inference in Embedded Edge Device

Author:Sun, Hao; Hao, Xiaoran; Xie, Mande

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 1, pp. 15-18. DOI: 10.1109/LES.2025.3566669

9
High-Speed True Random Number Generator With Multiple Entropy Sources: Ring Oscillator Jitter and Random Telegraph Nois

Author:Liu, Yizhi; Wu, Yifan; Chen, Bo; Sang, Pengpeng; Wu, Jixuan; Wei, Xiangye; Zhan, Xuepeng; Chen, Jiezhi

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 1, pp. 48-51. DOI: 10.1109/LES.2025.3549110

10
Optimizing Internal Communication of Compute-in-Memory-Based AI Accelerato

Author:Huang, Letian; Cao, Wenxu; Sun, Linhan; Li, Zeyu; Wang, Ruitai; Song, Junyi; Jiang, Shuyan

Journal: IEEE EMBEDDED SYSTEMS LETTERS. 2026; Vol. 18, Issue 1, pp. 81-84. DOI: 10.1109/LES.2025.3559333


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Ieee Embedded Systems Letters

国际简称:IEEE EMBED SYST LETT参考译名:IEEE 嵌入式系统快报

年发文量:109 CiteScore:4.1 是否预警:否 Gold OA文章占比:4.32% 研究类文章占比:100.00%

杂志社联系方式:445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

Ieee Embedded Systems Letters