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Ieee Transactions On Semiconductor Manufacturing

Ieee Transactions On Semiconductor Manufacturing杂志,由Institute of Electrical and Electronics Engineers Inc.出版,于1988年创刊,Quarterly,出版语言English,ISSN:0894-6507,E-ISSN:1558-2345。

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Ieee Transactions On Semiconductor Manufacturing
Ieee Transactions On Semiconductor Manufacturing
Ieee Transactions On Semiconductor Manufacturing
SCI SCIE EI

杂志介绍

JCR分区
Q3
中科院分区
3区
影响因子
2.5
CiteScore
4.8
期刊收录
SCI、SCIE、EI

Ieee Transactions On Semiconductor Manufacturing(中文译名:《半导体制造的IEEE交易》),ISSN:0894-6507,EISSN:1558-2345,是Institute of Electrical and Electronics Engineers Inc.出版的国际性学术期刊,创刊于1988年,以Quarterly形式稳定发行,2026年总发文量约98篇。该刊采用非OA开放访问,学科归属为工程技术 - 工程:电子与电气。该刊是工程技术、工程制造领域的国际权威刊物,已被SCI(科学引文索引)、SCIE(科学引文索引扩展版)、EI(工程索引)等国际主流学术数据库收录。2026年期刊影响因子达2.5,2025年期刊CiteScore为4.8,2025年期刊自引率约4%,在中科院期刊分区体系中位列工程技术大类3区,在所属学科领域具备高学术影响力与国际认可度。Ieee Transactions On Semiconductor Manufacturing长期聚焦工程技术、工程制造及相关产业的技术应用前沿,平均审稿周期约6.0个月,审稿流程高效稳定。在稿件录用评判中,该刊将创新性与前沿性作为核心遴选标准,重点收录能够对工程技术、工程制造领域的落地与发展产生实质性推动价值的研究成果。

从全球发文格局来看,USASouth Korea、CHINA MAINLAND、Japan、Taiwan、GERMANY (FED REP GER)、Belgium等为核心发文国家与地区;SAMSUNGGLOBALFOUNDRIES、SAMSUNG ELECTRONICS、KOREA ADVANCED INSTITUTE OF SCIENCE & TECHNOLOGY (KAIST)、UNIVERSITY OF NORTH CAROLINA、INTEL CORPORATION、NATIONAL TSING HUA UNIVERSITY等高校与科研机构是期刊的主要发文单位。

期刊评价

名词解释:

影响因子(Impact Factor, IF):指该期刊前两年发表的文章,在第三年的平均被引用次数。它反映了期刊的近期平均影响力和热度。

中科院分区:中科院分区表是国内主流的学术期刊分级评价工具,核心意义是建立跨学科可比的统一评价标尺,为职称评审、学位授予、科研立项等科研管理工作提供标准化量化依据,同时帮助科研人员筛选优质期刊、规避学术风险,适配国内本土化的科研评价需求。

期刊分区表

《新锐期刊分区表》(2026年3月发布)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
ENGINEERING, MANUFACTURING 工程:制造 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 PHYSICS, APPLIED 物理:应用 PHYSICS, CONDENSED MATTER 物理:凝聚态物理
4区 4区 3区 3区

期刊分区表(2025年3月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
4区
PHYSICS, CONDENSED MATTER 物理:凝聚态物理 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 ENGINEERING, MANUFACTURING 工程:制造 PHYSICS, APPLIED 物理:应用
3区 4区 4区 4区

期刊分区表(2023年12月升级版)

大类学科 小类学科 Top期刊 综述期刊
工程技术
3区
PHYSICS, APPLIED 物理:应用 PHYSICS, CONDENSED MATTER 物理:凝聚态物理 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气 ENGINEERING, MANUFACTURING 工程:制造
3区 3区 4区 4区

JCR分区

2025-2026年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 204 / 369

44.9

学科:ENGINEERING, MANUFACTURING SCIE Q3 53 / 71

26.1

学科:PHYSICS, APPLIED SCIE Q3 114 / 191

40.6

学科:PHYSICS, CONDENSED MATTER SCIE Q3 45 / 81

45.1

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 218 / 371

41.37

学科:ENGINEERING, MANUFACTURING SCIE Q3 50 / 71

30.28

学科:PHYSICS, APPLIED SCIE Q3 114 / 191

40.58

学科:PHYSICS, CONDENSED MATTER SCIE Q2 36 / 81

56.17

2024-2025年最新版

按JCI指标学科分区 收录子集 分区 排名 百分位
学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 198 / 368

46.3

学科:ENGINEERING, MANUFACTURING SCIE Q3 49 / 71

31.7

学科:PHYSICS, APPLIED SCIE Q3 114 / 187

39.3

学科:PHYSICS, CONDENSED MATTER SCIE Q3 48 / 80

40.6

学科:ENGINEERING, ELECTRICAL & ELECTRONIC SCIE Q3 212 / 368

42.53

学科:ENGINEERING, MANUFACTURING SCIE Q3 47 / 71

34.51

学科:PHYSICS, APPLIED SCIE Q3 111 / 187

40.91

学科:PHYSICS, CONDENSED MATTER SCIE Q2 40 / 80

50.63


中国学者近期发文

1
Reinforcement Learning-Optimized Adaptive LESO for Disturbance Rejection in Magnetically Suspended Turbo Molecular Pump

Author:Zheng, Shiqiang; Hao, Mohan; Mao, Kun; Ma, Wenyue; Han, Xue; Yang, Quanyao

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2026; Vol. 39, Issue 1, pp. 129-138. DOI: 10.1109/TSM.2025.3638245

2
Modeling and Scheduling of Dual-Arm Cluster Tools With Multifunctional Process Module

Author:Wu, Guanzhong; Xiong, Wenqing; Pan, Chunrong

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2026; Vol. 39, Issue 1, pp. 91-104. DOI: 10.1109/TSM.2025.3621092

3
Multi-Scale Content-Aware Enhancement Dual-Branch CNN for LED-Chip Defect Classificatio

Author:Wei, Linyu; Cai, Jueping

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2026; Vol. 39, Issue 1, pp. 62-73. DOI: 10.1109/TSM.2025.3642343

4
Data-Driven Coordinated Control of Czochralski Silicon Single Crystal Growth Operation Process Based on Indirect Control Strateg

Author:Ren, Jun-Chao; Liu, Ding; Wan, Yin

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2026; Vol. 39, Issue 1, pp. 36-45. DOI: 10.1109/TSM.2025.3620675

5
A Condition Monitoring Method via a New Signal Expansion Strategy for the Crystal Lifting and Rotating Mechanis

Author:Mu, Lingxia; Liu, Ding; Wu, Shihai; Liu, Yuyu; Gao, Peiyuan; Liu, Han; Zhang, Youmin

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2026; Vol. 39, Issue 1, pp. 115-128. DOI: 10.1109/TSM.2025.3619539

6
Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Grippe

Author:Zhai, Peiran; Xu, Zhoulong; Yin, Zhouping; Li, Xiaohang; Xie, Bin; Wu, Hao

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2025; Vol. 38, Issue 2, pp. 324-331. DOI: 10.1109/TSM.2025.3553559

7
Fast and Accurate EUVL Thick-Mask Model Based on Multi-Channel Attention Networ

Author:Yu, Chengzhen; Liu, Sheng; Chen, Wensheng; Ma, Xu

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2025; Vol. 38, Issue 2, pp. 194-202. DOI: 10.1109/TSM.2025.3539300

8
Fabrication of Porous Cu-Sn Microbumps for Low-Temperature Cu-Cu Bondin

Author:Wang, Zilin; Shi, Yunfan; Zhang, Qingchao; Zhou, Yikang; Wang, Qian; Wang, Zheyao

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2025; Vol. 38, Issue 2, pp. 343-351. DOI: 10.1109/TSM.2025.3529683

9
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Image

Author:Qiao, Yibo; Chen, Yanning; Liu, Fang; Mei, Zhouzhouzhou; Luo, Yuening; Chen, Yining; Liao, Yiyi; Wu, Bo; Deng, Yongfeng

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2025; Vol. 38, Issue 2, pp. 185-193. DOI: 10.1109/TSM.2025.3546296

10
Stability Improvement of Power MOSFET-Driven Plasma Generation Device for Thin Film Deposition and Chamber Cleanin

Author:Pan, Xiaogang; Liu, Kangli; Zhao, Jianfeng; Jin, Cheng; Zhu, Guojun; Zhu, Peiwen

Journal: IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING. 2025; Vol. 38, Issue 2, pp. 352-355. DOI: 10.1109/TSM.2025.3532355


在线咨询

Ieee Transactions On Semiconductor Manufacturing

国际简称:IEEE T SEMICONDUCT M参考译名:半导体制造的IEEE交易

年发文量:98 CiteScore:4.8 是否预警:否 Gold OA文章占比:4.51% 研究类文章占比:100.00%

杂志社联系方式:IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141

Ieee Transactions On Semiconductor Manufacturing